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Realistic photo of a populated PCB with antenna, RF test equipment, and an engineer at a workbench
August 3, 2026

Antenna placement small electronics: Top mistakes

Practical, engineering focused guidance on antenna placement small electronics, including a decision framework, checklist, testing best practices, and a concrete Futurezen RF review offer to reduce certification risk...
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Engineers testing wearable PCB and battery on a workbench with measurement equipment, close up photo
July 31, 2026

Battery Life in Wearables: Design Choices That Matter

Practical guidance on battery life in wearables for AI devices: budgeting, firmware, thermal tests, and charging case tradeoffs to guide product decisions.
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Technician assembling and testing a populated PCB on a factory bench with test equipment in the background
July 28, 2026

Electronics Manufacturing Brief: What to Include

Practical guidance on creating an electronics manufacturing brief that aligns suppliers, reduces certification risk, and speeds pilot to production.
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Photorealistic photo of prototype enclosures on an engineering workbench including CNC part, 3D print, and urethane cast sample with PCB and test gear
July 24, 2026

Plastic Tooling vs CNC Enclosure: Practical Guide

Practical tradeoffs between plastic tooling vs CNC enclosure for prototypes, pilots, and production. Covers cost, tolerance, finish, revisions, MOQ, and sourcing notes.
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Hardware engineering workbench with PCB wireless modules, RF test cables, laptop schematic, and probe testing
June 29, 2026

Bluetooth vs Wi-Fi vs 4G vs LoRa: Choosing Connectivity for Your Device

A practical Bluetooth Wi-Fi 4G LoRa comparison for hardware founders and OEM buyers. Learn tradeoffs in range, power, data rates, certification, antenna needs, module cost, SIM and production...
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AI smart glasses display hardware prototype with waveguide lens and compact electronics
June 23, 2026

How Are AI Smart Glasses Getting a Screen in the Glass?

A practical overview of smart glasses display technology for OEMs and founders. Compare waveguides, microLED projection, birdbath optics, brightness, FOV, heat, battery impacts, and key manufacturing tradeoffs.
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Hardware engineering scene related to Using Small External Flash in Connected Devices: 4MB, 8MB, BOM Cost, and Supply Planning
June 5, 2026

Using Small External Flash in Connected Devices: 4MB, 8MB, BOM Cost, and Supply Planning

Practical guide on when small external flash is sufficient for firmware, logs, OTA buffers, and configuration. Includes package choices, BOM impact, and supply planning advice for hardware teams.
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Hardware engineering scene related to Regular Speakers vs Mylar Speakers: Durability, Water Resistance, Cost, and Sound Quality
June 2, 2026

Regular Speakers vs Mylar Speakers: Durability, Water Resistance, Cost, and Sound Quality

Guide to regular versus mylar speaker choices for connected devices.
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AI note taker prototype with microphone array, charging hardware, PCB, and casing parts on an engineering bench
May 26, 2026

How to Create an AI Note Taker Product: Hardware, Casing, Charging, Connectivity, and UX Decisions

A practical AI note taker product development guide for hardware founders and OEM buyers. Covers casing choices, MEMS microphones, charging, connectivity, BOM planning, and production tradeoffs with Shenzhen...
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MEMS microphone components and connected device audio hardware on an engineering bench
May 15, 2026

MEMS Microphones for Connected Devices: Selection, Placement, and Manufacturing Tradeoffs

Practical guidance for hardware teams on selecting a MEMS microphone: analog vs digital, sensitivity, port placement, enclosure leakage, sourcing, and production test fixtures for connected devices and OEM...
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